Method for inlaying gold ornament and housing made by the method

ABSTRACT

A method for inlaying a gold ornament is disclosed. A substrate is provided which has an outer surface. A groove is defined in the substrate through the outer surface. A gold ornament is manufactured. The gold ornament has substantially the same shape as the groove. The gold ornament is placed in the groove wherein is positioned with metallic solder. Then the substrate is heated, whereby the melting and subsequent cooling of the solder bonds the gold ornament to the substrate. A housing for electronic device inlaid with a gold ornament made by the present method is also provided.

BACKGROUND

1. Technical Field

The present disclosure generally relates to a method for inlaying a gold ornament into a metal substrate and a housing for electronic devices with the gold ornament.

2. Description of Related Art

Housings for electronic devices, such as mobile phones, inlaid with gold ornaments may be popular. Fusion welding is a typical method for inlaying gold ornaments in metal housings. Specifically, a gold welding rod is melted and filled into a groove to form an ornament. However, it is difficult to accurately control the quantity of gold melted into the grooves resulting in too little or too much gold being used which may degrade the appearance of the housing.

Therefore, there is room for improvement within the art.

BRIEF DESCRIPTION OF THE DRAWINGS

Many aspects of the method for inlaying gold ornament and housing made by the method can be better understood with reference to the following drawings. The components in the drawings are not necessarily to scale, the emphasis instead being placed upon clearly illustrating the principles of the present method and the housing made by the same.

FIG. 1 is a schematic cross-section view of an exemplary embodiment of the present housing without any ornament inlaid.

FIG. 2 is a schematic cross-section view of the housing shown in FIG. 1 inlaid with a gold ornament.

DETAILED DESCRIPTION

FIG. 2 shows an exemplary housing 10 made according to an exemplary method for inlaying a gold ornament into a metal substrate. The method includes at least the following steps: providing a substrate, the substrate having an outer surface; defining a groove in the substrate through the outer surface; manufacturing a gold ornament by numerical control of slow speed wire-cutting according to the shape of the groove; placing the gold ornament in the groove in which is positioned metallic solder; and heating the substrate, the metallic solder melting and bonding the gold ornament to the substrate. Each step is described in more detail below.

A substrate 12, such as a preformed housing for a mobile phone, is provided. The substrate 12 may be made of metal material, e.g., stainless steel, copper, magnesium alloy, aluminum alloy, or titanium alloy. The substrate 12 has an outer surface 120.

Referring to FIG. 1, a groove 121 is defined into the substrate 12 through the outer surface 120. The groove 121 may be formed using a computer numerical controlled (CNC) milling machine to ensure high precision. The groove 121 has a shape desired for the shape of a gold ornament, e.g., line shape, arc shape, or wave shape.

A gold ornament 16 is manufactured by using a numerical controlled (NC) slow speed wire-cutting machine according to the shape of the groove 121. The gold ornament 16 can have a dimension tolerance of about ±0.02 mm or less.

Metallic solder 14 is positioned in the groove 121, such as on the bottom wall 123 of the groove 121. The metallic solder 14 can be tin paste or metallic powder.

The gold ornament 16 is placed in the groove 121. The gold ornament 16 may be coplanar with or protrude from the outer surface 120.

The substrate 12 combined with the gold ornament 16 is heated. The metallic solder 14 is melted and then when it cools, bonds the gold ornament 16 and the substrate 12. The heating step may be carried out in a furnace.

It should be understood that, when the gold ornament 16 provided protrudes from the outer surface 120, the protruding portion of the gold ornament 16 may be treated after the heating to be coplanar with the outer surface 120.

The housing 10 for electronic device made by the method as described above includes a substrate 12, and a gold ornament 16 inlaid in the substrate 12. The substrate 12 may be made of a metal material selected from a group consisting of stainless steel, copper, magnesium alloy, aluminum alloy, and titanium alloy. The substrate 12 has an outer surface 120 and defines a groove 121 through the outer surface 120. The gold ornament 16 is accommodated in the groove 121. Metallic solder 14 is positioned in the groove 121 (such as the bottom wall 123) and bonds the gold ornament 16 to the substrate 12. The metallic solder 14 may be tin paste or metallic powder.

In the present embodiment, the groove 121 and the gold ornament 16 are formed using numerical controlling machines, therefore, the gold ornament 16 engages precisely in the groove 121 with a nice appearance on the whole. Additionally, the gold ornament 16 is fixed to the substrate 12 by a soldering process to ensure a secure bonding between the gold ornament 16 and the substrate 12.

It should be understood, however, that even though numerous characteristics and advantages of the present embodiments have been set forth in the foregoing description, together with details of the structures and functions of the embodiments, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed. 

1. A method for inlaying a gold ornament, comprising: providing a substrate, the substrate having an outer surface; defining a groove in the substrate through the outer surface; manufacturing a gold ornament having substantially the same shape as the groove; placing metallic solder in the groove; placing the gold ornament in the groove with the metallic solder; and heating the substrate, whereby the melting and subsequent cooling of the solder bonds the gold ornament to the substrate.
 2. The method as claimed in claim 1, wherein the gold ornament is formed by numerical control of slow speed wire-cutting.
 3. The method as claimed in claim 1, wherein the metallic solder is tin paste or metallic powder.
 4. The method as claimed in claim 1, wherein the substrate is metal.
 5. The method as claimed in claim 1, wherein the groove is formed by a computer numerical controlled milling machine.
 6. The method as claimed in claim 1, wherein the gold ornament is coplanar with the outer surface when placed in the groove.
 7. The method as claimed in claim 1, wherein the gold ornament protrudes from the outer surface when placed in the groove.
 8. The method as claimed in claim 6, wherein the method further comprises treating the gold ornament to be coplanar with the outer surface after the heating step.
 9. A housing for electronic device, comprising: a substrate, the substrate defining a groove; a gold ornament, the gold ornament being accommodated in the groove; and a metallic solder positioned in the groove, the metallic solder bonding the gold ornament and the substrate.
 10. The housing as claimed in claim 9, wherein the metallic solder is tin paste or metallic powder.
 11. The housing as claimed in claim 9, wherein the metallic solder is formed on the bottom wall of the groove.
 12. The housing as claimed in claim 9, wherein the substrate is metal. 